Our Process

We have a unique direct mastering process that does not require a photomask. Our manufacturing and measuring equipment

• Photo-resist coating equipment in line for 200 mm wafer.
• Exposure equipment with down to 1 nm translation accuracy and measuring
• Sputtering coating equipment
• Plasma etching equipment RIE and DRIE
• Diffraction measurement equipment
• High power optical microscope
• Profilometer
• Atomic Force Microscope (AFM)
• Silicon and Glass cleaning systems
• Nickel Electroplating equipment
• Backside finishing and punching equipment
• Clean room packaging and sealing